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Substrate Properties
As fired 99.6% Alumina
CLA Surface Roughness (µ-inches) < 4
Thickness Available (inches) .005-.025
Thickness Tolerance (inches) +/- 0.001
Dissipation Factor at 1 MHz 0.0001
Dielectric Constant (k) @ 1 MHz 9.9
Thermal Conductivity (W/mK) 30
Coefficient of Thermal Exp. (ppm/°C) 7.0-8.3 (25-1000°C)
Applications Low to medium power DC & RF circuits
Polished 99.6% Alumina
CLA Surface Roughness (µ-inches) < 1
Thickness Available (inches) .004-.040
Dissipation Factor at 1 MHz 0.0001
Thickness Tolerance (inches) +/- 0.0005
Dielectric Constant (k) @ 1 MHz 9.9
Dielectric Constant (k) @ 4 MHz 9.9
Dielectric Constant (k) @ 10 MHz 9.7
Thermal Conductivity (W/mK) 30
Coefficient of Thermal Exp. (ppm/°C) 7.0-8.3 (25-1000°C)
Applications Low to medium power RF and Microwave circuits
Lapped 98% Aluminum Nitride
CLA Surface Roughness (µ-inches) 25
Thickness Available (inches) .004-.120
Thickness Tolerance (inches) +/- 0.001
Dissipation Factor at 1 MHz 0.001
Dielectric Constant (k) 8.6
Thermal Conductivity (W/mK) 170 min
Coefficient of Thermal Exp. (ppm/°C) 4.6 at (25-300°C)
Applications High power DC/RF/microwave circuits
Polished 98% Aluminum Nitride
CLA Surface Roughness (µ-inches) < 2
Thickness Available (inches) .004-.100
Thickness Tolerance (inches) +/- 0.0005
Dissipation Factor at 1 MHz 0.0005
Dielectric Constant (k) 8.6
Thermal Conductivity (W/mK) 170 min
Coefficient of Thermal Exp. (ppm/°C) 4.6 (25-300°C)
Applications High power DC/RF/microwave circuits
Polished 99.5% Beryllium-Oxide
CLA Surface Roughness (µ-inches) < 3
Thickness Available (inches) .007-.080
Thickness Tolerance (inches) +/- 0.0005
Dissipation Factor at 1 MHz 0.0004
Dielectric Constant (k) 6.5
Thermal Conductivity (W/mK) 270
Coefficient of Thermal Exp. (ppm/°C) 9 (25-1000°C)
Applications High power DC/RF/microwave circuits
Ferrite/Garnet
CLA Surface Roughness (µ-inches) 4 - 40
Thickness Available (inches) .010 and up
Thickness Tolerance (inches) +/- 0.0005
Dissipation Factor at 1 MHz .00015 - .0025
Dielectric Constant (k) 14.5 - 17.6
Thermal Conductivity (W/mK) .7 - 4.5
Coefficient of Thermal Exp. (ppm/°C) 2.4 - 10.8
Applications Microwave, circulators, isolators, components
Borosilicate Glass
CLA Surface Roughness (µ-inches) < 3.9x10-8
Thickness Available (inches) 0.02756 - 1.000
Thickness Tolerance (inches) +/- 0.0005
Dissipation Factor at 1 MHz .00037
Dielectric Constant (k) 4
Thermal Conductivity (W/mK) 1.2
Coefficient of Thermal Exp. (ppm/°C) 3.25 (through 300°C)
Applications Optical windows, biomedical
Sapphire
CLA Surface Roughness (µ-inches) < .1
Thickness Available (inches) .003-.250
Thickness Tolerance (inches) +/- 0.0005
Dissipation Factor at 1 MHz 0.00086/0.0003
Dielectric Constant (k) 9.3-11.4
Thermal Conductivity (W/mK) 40
Coefficient of Thermal Exp. (ppm/°C) A plane at 25°C 5.3
Applications Optical
Polished Fused Silica/Z-Cut Quartz
CLA Surface Roughness (µ-inches) 60/40 optical
Thickness Available (inches) .003-.040
Thickness Tolerance (inches) +/- 0.0005
Dissipation Factor at 1 MHz 0.000015
Dielectric Constant (k) 3.8
Thermal Conductivity (W/mK) 1.4
Coefficient of Thermal Exp. (ppm/°C) 0.56
Applications High frequency circuits requiring extremely low loss performance
Silicon
CLA Surface Roughness (µ-inches) 7.8 x 10-7
Thickness Available (inches) .25mm - .5mm
Dissipation Factor at 1 MHz .005
Dielectric Constant (k) 11.8
Thermal Conductivity (W/mK) 125
Coefficient of Thermal Exp. (ppm/°C) 2.5
Applications Optical, medical, IR, sensors, components
Polished Titanates
CLA Surface Roughness (µ-inches) < 3
Thickness Available (inches) .005-.080
Thickness Tolerance (inches) +/- 0.0005
Dissipation Factor at 1 MHz 0.0004
Dielectric Constant (k) 38-200
Thermal Conductivity (W/mK) 1.8-4.2
Coefficient of Thermal Exp. (ppm/°C) 5.8
Applications RF & microwave circuits requiring high Q