Substrate Properties
As fired 99.6% Alumina
CLA Surface Roughness (µ-inches) < 4
Thickness Available (inches) .005-.025
Thickness Tolerance (inches) +/- 0.001
Dissipation Factor at 1 MHz 0.0001
Dielectric Constant (k) @ 1 MHz 9.9
Thermal Conductivity (W/mK) 30
Coefficient of Thermal Exp. (ppm/°C) 7.0-8.3 (25-1000°C)
Applications Low to medium power DC & RF circuits
Polished 99.6% Alumina
CLA Surface Roughness (µ-inches)< 1
Thickness Available (inches).004-.040
Dissipation Factor at 1 MHz0.0001
Thickness Tolerance (inches)+/- 0.0005
Dielectric Constant (k) @ 1 MHz9.9
Dielectric Constant (k) @ 4 MHz9.9
Dielectric Constant (k) @ 10 MHz9.7
Thermal Conductivity (W/mK)30
Coefficient of Thermal Exp. (ppm/°C)7.0-8.3 (25-1000°C)
ApplicationsLow to medium power RF and Microwave circuits
Lapped 98% Aluminum Nitride
CLA Surface Roughness (µ-inches)25
Thickness Available (inches).004-.120
Thickness Tolerance (inches)+/- 0.001
Dissipation Factor at 1 MHz0.001
Dielectric Constant (k)8.6
Thermal Conductivity (W/mK)170 min
Coefficient of Thermal Exp. (ppm/°C)4.6 at (25-300°C)
ApplicationsHigh power DC/RF/microwave circuits
Polished 98% Aluminum Nitride
CLA Surface Roughness (µ-inches)< 2
Thickness Available (inches).004-.100
Thickness Tolerance (inches)+/- 0.0005
Dissipation Factor at 1 MHz0.0005
Dielectric Constant (k)8.6
Thermal Conductivity (W/mK)170 min
Coefficient of Thermal Exp. (ppm/°C)4.6 at (25-300°C)
ApplicationsHigh power DC/RF/microwave circuits
Polished 99.5% Beryllium-Oxide
CLA Surface Roughness (µ-inches)< 3
Thickness Available (inches).007-.080
Thickness Tolerance (inches)+/- 0.0005
Dissipation Factor at 1 MHz0.0004
Dielectric Constant (k)6.5
Thermal Conductivity (W/mK)270
Coefficient of Thermal Exp. (ppm/°C)9 at (25-1000°C)
ApplicationsHigh power DC/RF/microwave circuits
Ferrite/Garnet
CLA Surface Roughness (µ-inches)4 – 40
Thickness Available (inches).010 and up
Thickness Tolerance (inches)+/- 0.0005
Dissipation Factor at 1 MHz.00015 – .0025
Dielectric Constant (k)14.5 – 17.6
Thermal Conductivity (W/mK).7 – 4.5
Coefficient of Thermal Exp. (ppm/°C)2.4 – 10.8
ApplicationsMicrowave, circulators, isolators, components
Borosilicate Glass
CLA Surface Roughness (µ-inches)< 3.9×10-8
Thickness Available (inches)0.02756 – 1.000
Thickness Tolerance (inches)+/- 0.0005
Dissipation Factor at 1 MHz.00037
Dielectric Constant (k)4
Thermal Conductivity (W/mK)1.2
Coefficient of Thermal Exp. (ppm/°C)3.25 (through 300°C)
ApplicationsOptical windows, biomedical
Sapphire
CLA Surface Roughness (µ-inches)< .1
Thickness Available (inches).003-.250
Thickness Tolerance (inches)+/- 0.0005
Dissipation Factor at 1 MHz0.00086/0.0003
Dielectric Constant (k)9.3-11.4
Thermal Conductivity (W/mK)40
Coefficient of Thermal Exp. (ppm/°C)A plane at 25°C 5.3
ApplicationsOptical
Silicon
CLA Surface Roughness (µ-inches)7.8 x 10-7
Thickness Available (inches).25mm – .5mm
Dissipation Factor at 1 MHz.005
Dielectric Constant (k)11.8
Thermal Conductivity (W/mK)125
Coefficient of Thermal Exp. (ppm/°C)2.5
ApplicationsOptical, medical, IR, sensors, components
Polished Titanates
CLA Surface Roughness (µ-inches)< 3
Thickness Available (inches).005-.080
Thickness Tolerance (inches)+/- 0.0005
Dissipation Factor at 1 MHz0.0004
Dielectric Constant (k)38-200
Thermal Conductivity (W/mK)1.8-4.2
Coefficient of Thermal Exp. (ppm/°C)5.8
ApplicationsRF & microwave circuits requiring high Q
Polished Fused Silica/Z-Cut Quartz
CLA Surface Roughness (µ-inches)60/40 optical
Thickness Available (inches).003-.040
Thickness Tolerance (inches)+/- 0.0005
Dissipation Factor at 1 MHz0.000015
Dielectric Constant (k)3.8
Thermal Conductivity (W/mK)1.4
Coefficient of Thermal Exp. (ppm/°C)0.56
ApplicationsHigh frequency circuits requiring extremely low loss performance